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Acid Pickling / 酸盐处理剂

Pickling is a metal surface treatment used to remove impurities, such as stains, inorganic contaminants, rust or scale from ferrous metals, copper, and aluminum alloys. A solution called Acid Pickling, which contains strong acids, is used to remove the surface impurities. It is commonly used to descale or clean steel in various steelmaking processes.
Code Product
 
产品
Functions/Features
 
功能/特征
QEM 2436 Acid Etching Additive For Magnesium
 
镁合金酸洗添加剂
Provide uniform etching surface in crevices, blind holes and knurled areas.
 
有利于裂缝、盲孔和边角处酸洗,表面均匀。
QEM 2523 Surface Demusting
 
表面除膜剂
Able to remove smut-film from the surface of the polishing work.
 
去除化学抛光后的氧化膜,避免出现白雾状镀层。
QEM 2525 Activator For Magnesium
 
镁合金活化剂
Activate magnesium alloy surface, help to plating without zincate conversion.
 
活化镁合金表面,有助无锌转化直接电镀。
QEM 2526 Activator For Electroless Copper & EN Plating
 
化学铜和化学镍活化剂
Activate metal surface prior Electroless Copper or EN Plating.
 
化学铜与化学镍前处理活化剂。
QEM 2563 Dry Acid Salt For Lead Alloys
 
铅锡专用酸盐粉
Uniform removal of rust, oxides and scales from leaded brass, tin-lead alloys, lead, copper, brass and steel.
 
有效的洁净不同种类的铅,铅锡,铅铜,铜合金及碳钢,除去污渍粉末和氧化膜。
QEM 2566 Salt Acid Substitute
 
酸式盐
An acid salt used as a substitute for hydrofluoric acid baths.
 
粉状酸盐药剂,使用安全,加入酸液中使用时可代替氢氟酸。
QEM 2568 Dry Acid Salt
 
万用酸盐
Dry acid used in plating process instance of liquid.
 
可用来改善镀覆工艺。适用于钢,黄铜,铜,锌,铝,锡铅合金,镍基合金和镍铁合金去除锈斑,氧化物和污渍。
QEM 2820 Wetting Agent For Etching
 
润湿剂
Liquid additive used for etching solution as pre-treat magnesium and plastics material.
 
用于预处理镁和塑料材料的酸性腐蚀液体添加剂。
QEM 3362 Acid Additive For Steel Alloys
 
钢铁合金的酸洗添加剂
Acidic additive used with acid solution in pre-treatment of plating process for micro-deburring of steel alloys.
 
添加在酸溶洗液中,可去除钢铁合金的微小毛刺。
QEM 4031 EN Activator For Aluminium Alloys
 
铝合金化学镀镍活化剂
Mild etch for aluminium and aluminium alloys.
 
能在铝及铝合金表面产生适当的蚀刻,清洁活化表面。
QEM 8027 Mild Acidic Cleaning For Copper
 
铜酸洗剂
Powder, remove scale, oxides, and metallic films from copper alloys. Suit for PCB.
 
粉状固体,适用于铜和印刷线路板的酸洗。去除锈皮,氧化膜,以及金属薄膜。