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EN Plating / 化学镀镍

Electroless nickel plating is an auto-catalytic reaction used to deposit a coating of nickel on a substrate. This plating technique is to prevent corrosion and wear. Electroless nickel plating has several advantages versus electroplating. Free from flux-density and power supply issues, it provides an even deposit regardless of workpiece geometry, and with the proper pre-plate catalyst, can deposit on non-conductive surfaces.
Code Product
 
产品
Functions/Features
 
功能/特征
QEM EN 1026 EN Process for Zinc Alloy
 
锌合金化学镀镍工艺
Directly plating process without cyanide copper. (1-4% phosphorous)
 
在锌合金基体上直接形成低磷的镍磷合金镀层。替代传统的锌合金氰化镀铜打底,无毒,工艺简单。环保产品符合ELV和RoHS指令。(磷含量1-4%)
QEM EN 1027 Nickel Sulfamate Base Low Phosphorus EN Process
 
氨基磺酸镍低磷化学镍
ELV and RoHS compliant process for bright, low phosphorous, electroless nickel plating process. (1-4% phosphorous)
 
环保产品符合ELV和RoHS指令,光亮快速低磷镀镍。(磷含量1-4%)
QEM EN 1028 Lead & Cadium Free Low Phosphorous EN Plating Process
 
无铅无镉低磷低温快速化学镀镍
ELV and RoHS compliant process for bright, low phosphorous, electroless nickel plating process. (1-4% phosphorous)
 
环保产品符合ELV和RoHS指令,光亮快速低磷镀镍。(磷含量1-4%)
QEM EN 1031 Lead & Cadium Free High Phosphorous EN Plating Process
 
无铅无镉高磷抗腐蚀性化学镀镍工艺
Semi-bright, high phosphorous, corrosion resistant EN plating. (10.5-12% phosphorous)
 
环保产品符合ELV和RoHS指令,在不规则基体上形成一层半光亮,含磷成份高的镍合金镀层。耐腐蚀性好。(磷含量10.5-12%)
QEM EN 1031D EN Process For Magnesium
 
镁合金化学镀镍工艺
Direct plating process without zincate, good corrosion resistance. (7-10% phosphorous)
 
适用各种镁合金,不需锌转换层,直接电镀,抗腐蚀性强。(磷含量7-10%)
QEM EN 1060 Semi Bright Medium Phosphorous
EN Process
 
无铅无镉快速,半光亮中磷化学镀镍工艺
A high speed, semi bright, medium phosphorous, ELV and RoHS compliant process. (7-10% phosphorous)
 
耐腐蚀性好,镀液稳定,镀层为半光亮的银白色。具有装饰性光泽。(磷含量7-10%)
QEM EN 1066 Lead & Chamium free, EN Plating Process For PCB
 
无铅无镉抗腐蚀性化学镀镍工艺
ELV and RoHS compliant EN process, suitable for PCB . (6-9% phosphorous)
 
环保中磷镍磷合金(磷含量6-9%) , 具有优良的初始反应, 沉积速度稳定,适用在印刷电路板上。
QEM EN 1077 EN Strike For Magnesium
Plating Process
 
镁合金预镀化学镍磷合金工艺
ELV and RoHS compliant process. High speed, low phosphorous EN plating process on magnesium alloy. (1-4% phosphorous)
 
无铅无镉,镁合金表面预镀镍磷合金镀层,快速低磷。(磷含量1-4%)
QEM EN 1087 EN Strike For Aluminium Plating Process
 
铝合金预镀化学镍磷合金工艺
EN strike plating process for aluminium alloy , produces a thin, uniform, active nickel layer, enhance adhesion. (1-4% phosphorous)
 
环保铝合金表面预镀镍磷合金镀层,提高结合力,快速低磷。(磷含量1-4%)
QEM EN 1088 Lead & Cadium Free Medium Phosphorous EN Plating Process
 
无铅无镉快速光亮中磷化学镀镍工艺
ELV and RoHS compliant process, bright, high speed electroless nickel plating process. (5-9% phosphorous)
 
无铅,铬,镉,汞及硅。中磷镍磷合金镀层,均匀光亮。适用各种材料,寿命长。(磷含量5-9%)
QEM EN 1098 Medium Phosphorous
EN Plating Process
 
中磷特亮快速化学镀镍工艺
A high speed, super bright, medium phosphorous, electroless nickel plating process. (5-9% phosphorous)
 
中磷镍磷合金镀层快速稳定,高耐腐蚀性,特亮。(磷含量5-9%)